Vj, L.; Kobayashi, N. P.; Islam, M. S.; Wu, W.; Chaturvedi, P.; Fang, N. X.; Wang, S. Y.; Williams, R. S., Ultrasmooth Silver Thin Films Deposited with a Germanium Nucleation Layer. Nano Letters 2009, 9, (1), 178-182.
Zhang, S.; Yin, L. L.; Fang, N., Focusing Ultrasound with an Acoustic Metamaterial Network. Physical Review Letters 2009, 102, (19).
Chaturvedi, P.; Hsu, K.; Zhang, S.; Fang, N., New Frontiers of Metamaterials: Design and Fabrication. MRS Bulletin 2008, 33, (10), 915-920.
Ambati M.; Fang, N.; Sun, C.; Zhang, X., Surface resonant states and superlensing in acoustic metamaterials. Physical Review B 2007, 75, 195447.
Hsu, K. H.; Schultz, P. L.; Ferreira, P. M.; Fang, N. X., Electrochemical nanoimprinting with solid-state superionic stamps. Nano Letters 2007, 7, (2), 446-451.
Liu Y.; Fang, N.; Wu, D.; Sun, C.; Zhang, X., Symmetric and antisymmetric modes of electromagnetic resonators. Applied Physics A 2007, 87, (2), 171-174.
Liu Z.; Durant, S.; Lee, H.; Pikus, Y.; Fang, N.; Xiong, Y.; Sun, C.; Zhang, X., Far-Field Optical Superlens, Nano Letters 2007, 7, (2), 403-408.
Liu Z.; Xi, D.; Pile, D.; Lou, Q.; Fang, N.; Zhang. X., Enhanced backward scattering by surface plasmons on silver film. Applied Physics A 2007, 87, (2), 157-160.
Schultz, P. L.; Hsu, K. H.; Fang, N. X.; Ferreira, P. M., Solid-state electrochemical nanoimprinting of copper. Journal of Vacuum Science & Technology B 2007, 25, (6), 2419-2424.
Wu, W.; Kim, E.; Ponizovskaya, E.; Liu, Y.; Yu, Z.; Fang, N.; Shen, Y. R.; Bratkovsky, A. M.; Tong, W.; Sun, C.; Zhang, X.; Wang, S. Y.; Williams, R. S., Optical metamaterials at near and mid-IR range fabricated by nanoimprint lithography. Applied Physics a-Materials Science & Processing 2007, 87, (2), 143-150.
Wu, W.; Yu, Z. N.; Wang, S. Y.; Williams, R. S.; Liu, Y. M.; Sun, C.; Zhang, X.; Kim, E.; Shen, Y. R.; Fang, N. X., Midinfrared metamaterials fabricated by nanoimprint lithography. Applied Physics Letters 2007, 90, (6), 063107.
Wu D. M.; Fang, N.; Sun, C.; Zhang, X. Stiction problems in releasing of 3D microstructures and its solution. Sensors and Actuators A 2006, 128, (1), 109-115.